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Clean Room Equipment List PDF Print
CR EQUIPMENT LIST
  • Deposition
  • Dry Etch
  • Thermal Process
  • Metrology
  • Lithography
  • Packing


Edwards/BOC Auto 306 #1
Thermal Evaporator
Metal thin film deposition.


Edwards/BOC Auto 306 #2
Thermal Evaporator
Metal and organic thin film deposition.


AJA International Rapier 700
Sputter System
RF sputtering for dielectric and metallic thin films; Ti and SiO2.


SEMICORE PECVD
Plasma Enhanced Chemical Vapor Deposition System
Deposition of SiO2, SiNx and amorphous Si films.


SEMICORE SC2000
E-beam Evaporation System
Metal and dielectric film deposition.


Cambridge Nano Tech Inc. Savannah 200
Atomic layer deposition system
Atomic level deposition of thin film materials.


Cressington Manual Sputter Coater



Oxford PlasmaLab 80 Plus
RIE
Reactive ion etching using Cl gas or BCl3 gas.


Oxford PlasmaLab 80 Plus
ICP 65
ICP anisotropic etching of Si, SiO2, SiN and dielectric materials.


TECHNICS Series 800
RIE (Oxygen Plasma Asher)
Etching of thin films, SiNx, SiO2, photoresist. Etch gases CF4O2, O2


UVOCs
UV Ozone Cleaner
Substrate surface cleaning using ozone.



AG Associates 410
Rapid Thermal Annealer
Ultra fast heating for annealing of defects with minimal diffusion.



Dektak 3
Profilometer
Thin film measurements; resist, metal deposited films.


Nikon Eclipse
Optical Microscope with INSIGHT Digital Camera and archival software
High resolution optical microscope with reflected and transmitted light, measurement function for sample inspection.


Rudolph El III
Ellipsomter
Fixed wavelength, fixed angle laser measurement of non metallic thin films.


Hitachi 800
Cold Cathode Field Emission SEM



Photolithography


Karl Suss MJB3 #1
Mask Aligner 365nm/405nm
3" sample, 4" mask, contact aligner.


Karl Suss MJB3 #2
Mask Aligner
Up to 4" samples, 4" mask; hard contact, soft contact aligner..


Optical Associates 28A Contact Aligner


E-Beam Lithography


FEI
E-Beam Writer


LEO
E-Beam Writer


Imprint Lithography


Nanonex Imprinter


Miscellaneous


Yield YES III
Vapor Prime Oven
Vapor deposition of Hexamethyldisilazane (HMDS) to promote resist adhesion.


Laurell WS-400Bz-4NPP-Lite
Single Wafer Spin Processor



Kulicke & Soffa 4123
Ultrasonic Wire Bonder
Ultrasonic and heated gold wire bonding.


Westbond 7476 D
Wire Bonder
Ultrasonic aluminum wire bonding.


Westbond 7477 E
Wire Bonder
Ultrasonic and heated gold wire bonding.


Kulicke & Soffa